Termalboard
Problem that solves
Reduces the risk of failures due to thermal shock; Minimizes energy losses due to inadequate insulation; Prevents deformation at high temperatures.Termalboard
Problem that solves
Reduces the risk of failures due to thermal shock; Minimizes energy losses due to inadequate insulation; Prevents deformation at high temperatures.Main applications
Burner blocks; Furnace internals; Furnace partitions and dividers; Boiler ducts; Heat shields; Chimney linings.Technical characteristics
Molded ceramic fiber boards with or without organic binders, pressed at high temperature, lightweight, machinable, asbestos-free, with low thermal conductivity, low shrinkage, resistant to thermal shocks and aggressive chemical atmospheres, ideal for insulation and thermal protection in severe industrial applications.Temperature: up to 1260 °C
Density: 300 - 400 kg/m³
Thermal Conductivity: ≤ 0.13 W/m*K
Dimension: Ø 50 mm (Type H)
Product sheet
FDS form